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PHOTO-image Solder Resist Ink | Heat Curing Solder Resist Ink| Peelable Solder Mask Ink & Plating Resist
PHOTO-image Solder Resist Ink
Alkali developing type photoimageable solder resist ink for high density pattern PWBs.
| PRODUCTS | DPR-805G , T-16 | DPR-805 , MW-2 | DPR-805 , CV-1 | DPR-5FG-1 | |
| Applications | Plated Thru-hole PWB (1 component) |
Marking Ink (White) (1 component) |
Marking Ink (Black) (1 component) |
Flexible PWB such as FPC or COF (2-com) |
|
| UV Exposure (mj) | 300~600 | 400~1,000 | 400~1,000 | 300~700 | |
| Post curing | 150°C × 60min. | 150°C × 60min. | 150°C × 60min. | 150°C × 60min. | |
| Adhesion (on Cu) | 100/100 | 100/100 | 100/100 | 100/100 | |
| Solder Resistance (260°C - 5sec.) |
≥4 times | ≥3 times | ≥3 times | 1 times | |
| Nonelectrolytic | Nickel Plating | Good | Good | Good | Good |
| Gold Plating | Good | - | Good | Good | |
| Tin Plating | - | - | - | - | |
| Surface Insulation (65°C - 95%RH) |
5 × 1012Ω | 1 × 1012Ω | 1 × 1012Ω | 6 × 1011Ω | |
| Shelf Life(25°C) | 3months | 3months | 3months | 2months | |
Heat Curing Solder Resist Ink
Heat Curing type CCR-series have excellent heat resistance and chemical resistance with good dielectric property. Most suitable for Cu, Sn/pb through hole PWBs.
| PRODUCTS | CCR-232GF No.6 | CCR-232CFV | CCR-240GS | CCR-1000 |
| Applications | for TAB w/quality (2-component) |
for Package PWB standard (2-comp.) |
Thru-hole PWB fine TAB (2-com) | Flexible PWB with no-warp (1-com) |
| Heat Curing | 130°C × 10min. | 130°C × 10min. | 130°C × 30min. | 150°C × 30min. |
| Adhesion (on Cu) | 100/100 | 100/100 | 100/100 | 100/100 |
| Plating resistance | Good (electrolytic Au) |
Good (electrolytic Au) |
Good (electrolytic Au) |
Good (nonelectrolytic Sn) |
| Glass Transition (Tg) | 152°C | 152°C | 145°C | 45°C |
| Solder resistance (260°C - 5sec.) |
≥3 times passed | ≥6 times passed | ≥3 times passed | 1 times passed |
| Surface Insulation (65°C - 95%RH) |
5 × 1012Ω | 5 × 1012Ω | 2 × 1012Ω | 5 × 1012Ω |
| Shelf Life (25°C) | 6 months | 3 months | 6 months | 2 months |
Peelable Solder Mask Ink & Plating Resist
Peelable Masking Inks & Plating Resist Ink for nonelectrolytic plating process
| PRODUCT | #503B-SH |
| Color & State | Blue paste |
| Viscosity (25°C) | 40~60Pa.s |
| hixotropic Index | 5 |
| Curing in box oven | 130~150°C×10min. |
| Surface Insulation | ≥1010Ω |
| Corrosion Test | Passed (on copper foil) |
| Solder Resist 5-sec. | ≥3 times |
| Reflow (220°C - 4min) |
≥4 times |
| Shelf Life(25°C) | 6months |
| PRODUCTS | MR-300RV / -300B |
| Color & State | RV (black paste) |
| B (blue paste) | |
| Solid Content (wt%) | 55 |
| Viscosity (25°C) | 20~30Pa.s |
| Drying Condition | 80°C × 10min. |
| Adhesion | 100/100 |
| Ni/Au Plating Resist. | Passed |
| Removing | 1~3%NaOH |
| Contamination | Very good |
