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Adhesives for Chip Components
[A] SA-series are one-component type epoxy adhesive for Chip/Melf components
| PRODUCTS | SA-33 P-2 | SA-250 series | SA-500 series |
| Application | For dispensing Standard type | SA-250P = Pin trans SA-250S = Screen |
High Speed dispense Low temp.-cure type |
| Color | Red paste | Red paste | Red paste |
| Viscosity | 50-70Pa.s (30°C) | 45-60Pa.s (25°C) | 45-75Pa.s (30°C) |
| Thixotropic index | 5.5 - 7.5 | 3.0 - 4.5 | 5.5 - 7.5 |
| Curing condition | 130°C × 60sec. | 130°C × 80sec. | 90°C × 60sec. |
| Tensile strength | ≥40N | ||
| Solder resistance | ≥15秒 | ||
| Volume resistivity | 1 × 1015Ω · cm | 4 × 1013Ω · cm | 4 × 1013Ω · cm |
| Shelf Life | 6 months (storing temperature 10°C) | ||
- 35g Syringe
- 300g Cartridge
[B] Conductive adhesives with epoxy resin binder as an alternative for soldering process.
| PRODUCT | LS-110 | LS-103 | ||
| Applications | Reliability and fine pitch | Low temperature curing | ||
| Viscosity (at 25°C) | 130 - 150Pa.s | 70 - 100Pa.s | ||
| Thixotropic index | 15 - 25 | 8 - 14 | ||
| Curing condition | 130°C × 30min. | 150°C × 5min. | 120°C × 20min. | 150°C × 5min. |
| Thermal conductivity | 1.5W/mk | 1.5W/mk | ||
| Volume resistivity | 5.0 × 10-4Ω · cm | 10-3Ω · cm | ||
| Tensile strength | 3Kgf | 2Kgf | ||
| Glass transition | 110°C | 110°C | ||
| Coefficient of Linear expansion | 40ppm (≤Tg) | 90ppm ( ≥Tg) | 40ppm (≤Tg) | 90ppm ( ≥Tg) |
| Shelf Life | 3 months( ≤-15° C) | 3 months( ≤-15° C) | ||
