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Insulation Paste for Build up | Polymer Thick Paste for Via-Plugging
Insulation Paste for Build up
PRODUCTS |
DESCRIPTION |
| FINE BUILD BM-350 |
Epoxy resin base, two components type insulation that is used for Build up board. ◆ Cured film has excellent adhesion, solvent resistance, heat resistance. ◆ It has excellent properties in laser drilling process. ◆ Easy desmear treatment, can get peel strength of Electro-less copper plate. ◆Cured film corresponds of [UL/94V-0], no used of chlorine, phosphorine and antimony base Fire Retardants. |
Polymer Thick Paste for Via-Plugging
High density, high function PWB can be achieved by filling VIH in Build up Process, Blind via in multi-layer process with PTF materials.
| PRODUCTS | LS-101S | FP-R130A1 | |
| Feature | Conductive | Non Conductive | |
| Material | Inorganic Filler | Silver powder | Sillice fine powder |
| Resin | Epoxy / 1 component | Epoxy / 1 component | |
| Curing conditions | Pre-cure | 110 - 130°C × 20 - 60min. | 120 - 140°C × 20-60min. |
| Post-cure | 150 - 180°C × 30 - 60min.. | 160 - 170°C × 30-60min. | |
| Volume resistivity | 4 × 10-4Ωcm | 5 × 1015Ωcm | |
| Glass transition point | 110°C | 120 - 130°C | |
| Coefficient of thermal expansion | 90 ppm | 40-50 ppm | |
| Thermal conductivity | 1.6 W/mK | 1.2 W/mK | |
| Shelf-life | 3 months | 3 months | |
We prepare the paste for your requirements
